覆晶式微發光二極體晶粒的製法及其製品

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

110128409

專利證號

I 807377

專利獲證名稱

覆晶式微發光二極體晶粒的製法及其製品

專利所屬機關 (申請機關)

國立陽明交通大學

獲證日期

2023/07/01

技術說明

一種覆晶式微發光二極體晶粒的製法，包含(a)提供一具有磊晶基板及磊製於磊晶基板上的微發光二極體晶粒陣列的元件單元，相鄰晶粒定義出切割線且各晶粒具鄰近磊晶基板的發光面、相反於發光面的電連接面及一對間隔設在各電連接面上的接觸電極；(b)晶圓鍵合各接觸電極至具有複數間隔設置之通道的金屬基板上以令各通道介於各對接觸電極間並於金屬基板之第一表面與接觸電極間形成間隙；(c)引入有機黏著膠至通道與間隙內；(d)薄化金屬基板；(e)移除磊晶基板；及(f)沿切割線分離該等晶粒從而製得一批覆晶式微發光二極體晶粒。本發明亦提供前述製法所製得的晶粒。This invention provides a method for making flip chip micro-LED chips, which comprises the following steps of (a) providing a device unit including an epitaxial substrate, and an array of micro-LED chips epitaxially growing on the epitaxial substrate, wherein the adjacent micro-LED chips defined a dicing line and each of the micro-LED chips has a lighting surface adjacent to the epitaxial substrate, a electrical connecting surface, and a pair of contact electrodes disposed apart from each other on the corresponding one of each electrical connecting surface; (b) wafer bonding each pair of the contact electrodes of the device unit onto a metal substrate having a plurality channels disposed apart each other, such that each of the channels located between the corresponding one of each pair of the contact electrodes, and formed a gap connecting the channels between a first surface of the metal substrate and the contact electrodes, wherein each of the channels penetrates the first surface of the metal substrate and a second surface opposite to the first surface; (c) introducing an organic adhesive into the gap and the channels; (d) thinning the metal substrate from the second surface; (e) removing the epitaxial substrate for exposing each of the lighting surfaces of the micro-LED chips; and (f) separating the micro-LED chips from each other along the dicing lines so as to make a batch of flip chip micro-LED chips. This invention also provides flip chip micro-LED chips made from the method stated above.